1109523, IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To JEDEC Through Hole
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- Код товара
- 8063741075
- Артикул
- 1109523
- Бренд
- Aries Electronics
- ECCN
- EAR99
- HTSUS
- 8536.69.4040
- Package
- Bulk
- Features
- Socket Included
Цена по запросу
(от 3 446,60 ₽)
Стоимость и сроки поставки подтвердит менеджер после заявки.
Описание
Переxодник для гнезда IC DIP, расстояние между рядами 0,3 дюйма (7,62 мм) До сквозного отверстия JEDEC
Технические параметры
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |
| Package | Bulk |
| Features | Socket Included |
| Вес, г | 1 |
| RoHS Status | RoHS non-compliant |
| Termination | Solder |
| REACH Status | REACH Unaffected |
| Mounting Type | Through Hole |
| Board Material | FR4 Epoxy Glass |
| Number of Pins | 8 |
| Pitch - Mating | 0.100"" (2.54mm) |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Finish - Post | Tin-Lead |
| Current Rating (Amps) | 1A |
| Contact Finish - Mating | Gold |
| Contact Material - Post | Brass |
| Termination Post Length | 0.125"" (3.18mm) |
| Convert To (Adapter End) | JEDEC |
| Contact Material - Mating | Beryllium Copper |
| Convert From (Adapter End) | DIP, 0.3"" (7.62mm) Row Spacing |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 200.0Вµin (5.08Вµm) |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Contact Finish Thickness - Mating | 10.0Вµin (0.25Вµm) |