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08-3518-10, IC & Component Sockets 8P SOLDER TIN/GLD

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Код товара
8004860342
Артикул
08-3518-10
Бренд
Aries Electronics
ECCN
EAR99
Type
DIP, 0.3"" (7.62mm) Row Spacing
HTSUS
8536.69.4040
Type:
Open Frame
Цена по запросу
(от 218,32 ₽)

Стоимость и сроки поставки подтвердит менеджер после заявки.

Описание

8 (2 x 4) посадочныx ОТВЕРСТИЙ, расстояние между рядами 0,3 дюйма (7,62 мм), Золотое сквозное отверстие

Технические параметры

ECCNEAR99
TypeDIP, 0.3"" (7.62mm) Row Spacing
HTSUS8536.69.4040
Type:Open Frame
Brand:Aries Electronics
Pitch:2.54 mm
PackageBulk
Series:518
FeaturesOpen Frame
Product:DIP/SIP Sockets
Features:Series 518
Вес, г0.9
RoHS StatusROHS3 Compliant
TerminationSolder
Pitch - Post0.100"" (2.54mm)
REACH StatusREACH Unaffected
Row Spacing:7.62 mm
Subcategory:IC & Component Sockets
Manufacturer:Aries Electronics
Mounting TypeThrough Hole
Product Type:IC & Component Sockets
Pitch - Mating0.100"" (2.54mm)
Current Rating:3 A
Mounting Style:Through Hole
Number of Rows:2 Row
Contact Plating:Gold
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Contact Material:Brass Alloy
Housing Material:Nylon
Product Category:IC & Component Sockets
Termination Style:Solder Tail
Flammability Rating:UL 94 V-0
Number of Positions:8 Position
Contact Finish - PostTin
Current Rating (Amps)3A
Contact Finish - MatingGold
Contact Material - PostBrass
Termination Post Length0.125"" (3.18mm)
Contact Material - MatingBeryllium Copper
Material Flammability RatingUL94 V-0
Maximum Operating Temperature:+125 C
Minimum Operating Temperature:-55 C
Contact Finish Thickness - Post200.0Вµin (5.08Вµm)
Moisture Sensitivity Level (MSL)1 (Unlimited)
Contact Finish Thickness - Mating10.0Вµin (0.25Вµm)
Number of Positions or Pins (Grid)8 (2 x 4)
Factory Pack Quantity: Factory Pack Quantity:49

Техническая документация